Advanced Thermal Design
X570 AORUS ULTRA reaches a perfect balance between style and performance by combining the media acclaimed Fins-Array heatsink and Direct Touch heatpipe, to heatpipe provide 30% lower MOSFET temperatures for enthusiasts, overclockers and professional gamers.
Fins-Array Heatsink with Direct Touch Heatpipe and High Thermal Conductivity Pad
X570 AORUS ULTRA uses Fins-Array Heatsink which increases the heat dissipation area by 300% compared to traditional heatsinks of the same size. Direct Touch Heatpipe helps transfer heat from MOS fins. By using LAIRD 1.5mm thick, 5W/mK high thermal conductivity pads, it can transfer 2.7x more heat compared to traditional thermal pads in the same time period.