1.Direct Touch Heatpipe
Heatpipe directly touches the heating source VRM components that guarantee good contact between VRM and heatsink.
2.Fins-Array Heatsink
Fins-Array Heatsink on both TMOS side and RMOS side uses the stacked-fins design which increasing the heat dissipation area by 300% as compared to traditional heatsinks of the same size and also providing at least 30% lower temperature on MOSFETs.
3.Thermal Baseplate
With the thermal baseplate, it enhances the thermal dissipating capability and also gives user a strong foundation to build their Gaming PCs.
4.LAIRD 7.5 W/mK Thermal Pad
By using LAIRD 7.5 W/mK high thermal conductivity pads, it can transfer 4x more heat as compared to traditional thermal pads in same time.
5.3X M.2 Thermal Guard
Enlarged M.2 thermal guard heatsink helps the high-speed, large capacity of PCIe 4.0/3.0 SSDs to prevent overheat throttling and performance bottlenecks.