Key Features
Sub-Ambient Cooling
Specifically designed Thermoelectric Unit (TEC) to cool your processor and create the conditions that allow it to achieve low core count over-clocking.
Powered by Intel Cryo Cooling Technology
Designed with a simple user interface which makes it easy to understand and control the sub-ambient cooling potential.
Cryo-Clocking
Silicon can reach higher frequencies at lower voltages that can only be achieved through sub-ambient cooling. The concept of Cryo-Clocking is to push the performance of the CPU to reach maximum capacity within the limits.
2nd Generation Pump
Enhanced pump delivers higher liquid flow for exceptional heat removal.