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Panduit Cmp-300-4-1 Surface Filler

Panduit Cmp-300-4-1 Surface Filler


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          Description :

          CMP, Copper-to-copper/copper-to-steel

          Panduit CMP-300-4-1. Application temperature (max): 177 °C

          Contact aid for copper-to-copper and copper-to-steel connections, 4 oz. Operating temperature range -40°F (-40°C) to 350°F (177°C). Good for all voltages and suitable for grounding. Also used for anti-seizing thread lubricant.

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